Two PDEng positions on electromagnetic modeling for wafer metrology

Eindhoven University of Technology (TU/e) has vacancies for

Two post-master PDEng positions on electromagnetic modeling for wafer metrology

in the Electromagnetics Group, department of Electrical Engineering.

Context of the PDEng projects
In the upcoming years, integrated circuits with an extremely high information-packing capacity, like NAND flash, will exhibit an increasing trend towards 3D stacking with ever increasing complexity in the build-up of the stack. An example of such 3D structures is a so-called V-NAND, see references [1,2]. In the manufacturing of these structures, it is important to monitor some of the fine details by means of metrology tools that are being developed at ASML. These metrology tools are formed by a measurement system on the one hand and computational modeling software on the other. One of the main challenges in the field of computational modeling for metrology is the construction of a Maxwell solver that can handle complicated 3D stacks. It should be able to accurately solve for the pertaining electromagnetic fields in a very short time-span. Next to high-complexity 3D stacks, another challenge for fast Maxwell solvers is formed by stacks containing combinations of metals and dielectrics [3].

New developments in integration and manufacturing technologies also have their impact on the level of complexity that needs to be handled by a Maxwell solver for metrology. This leads to new modeling challenges and opens up new perspectives in modeling approaches that are optimal with respect to new types of structures and materials. It is the aim of the two PDEng projects to address some of the challenges brought by highly integrated 3D structures.

Further details:
Two PDEng positions on electromagnetic modeling for wafer metrology