Επιστήμες Μηχανικών (2 θέσεις)
| 1 |
Senior Scientist- Fan out wafer level packaging / Heterogeneous Integration Technologies (f/m/d) |
|---|
| Silicon Austria Labs (SAL) |
Austria |
| 2 |
Beamline Technician for the Full-field Hard X-ray Imaging Beamline ID19 |
|---|
| ESRF - European Synchrotron Radiation Facility |
Grenoble, France |
Οικονομικές Επιστήμες (1 θέση)
| 1 |
Research Support Officer |
|---|
| Teagasc |
Carlow, IRELAND |
| Deadline : 26/08/2023 |
Θετικές Επιστήμες (1 θέση)
| 1 |
Senior Scientist- Fan out wafer level packaging / Heterogeneous Integration Technologies (f/m/d) |
|---|
| Silicon Austria Labs (SAL) |
Austria |
Επιστήμες Διοίκησης (1 θέση)
| 1 |
Research Support Officer |
|---|
| Teagasc |
Carlow, IRELAND |
| Deadline : 26/08/2023 |